| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| STM32L452RET6 | ST/意法 | LQFP64 | 24+ | 960 | 2026-06-27 | |||
| JL1111-N032I | JLSEMI/景略 | QFN | 23+ | 15223 | 2026-06-27 | |||
| STM32G474CBT6 | ST/意法 | LQFP | 22+ | 3522 | 2026-06-27 | |||
| ESP32-S3-WROOM-1U-N16R8 | ESPRESSIF/乐鑫 | SMD | 25+ | 2155 | 2026-06-27 | |||
| AD5290YRMZ100-R7 | ADI/亚德诺 | MSOP10 | 22+ | 358 | 2026-06-27 | |||
| 20279-001E-01 | NXP/恩智浦 | SMD | 24+ | 4500 | 2026-06-27 | |||
| STM32H757XIH6 | ST/意法 | TFBGA-265 | 23+ | 3588 | 2026-06-27 | |||
| MS560702BA03-50 | TE/泰科 | LGA8 | 25+ | 2600 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| STM32F207VET6 | ST/意法 | LQFP100 | 23+ | 1522 | 2026-06-27 | |||
| STM32H757XIH6 | ST/意法 | TFBGA-265 | 23+ | 3588 | 2026-06-27 | |||
| STM32G474CBT6 | ST/意法 | LQFP | 22+ | 3522 | 2026-06-27 | |||
| STM32L452RET6 | ST/意法 | LQFP64 | 24+ | 960 | 2026-06-27 | |||
| STM32C011F4U6TR | ST/意法 | UFQFPN-20 | 26+ | 6000 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MS560702BA03-50 | TE/泰科 | LGA8 | 25+ | 2600 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| 20279-001E-01 | NXP/恩智浦 | SMD | 24+ | 4500 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| JL1111-N032I | JLSEMI/景略 | QFN | 23+ | 15223 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| ESP32-S3-WROOM-1U-N16R8 | ESPRESSIF/乐鑫 | SMD | 25+ | 2155 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| AD5290YRMZ100-R7 | ADI/亚德诺 | MSOP10 | 22+ | 358 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| PIC16F883-I/SO | MICROCHIP/微芯 | SOP28 | 23+ | 1892 | 2026-06-27 | |||
| STM32F410CBT6 | ST/意法 | LQFP48 | 22+ | 2358 | 2026-06-27 | |||
| STM32G030F6P6 | ST/意法 | TSSOP20 | 25+ | 2966 | 2026-06-27 | |||
| STM32G071CBT6TR | ST/意法 | QFP48 | 25+ | 2400 | 2026-06-27 | |||
| LHE40-20B48 | MORNSUN/金升阳 | DIP | 2019+ | 48 | 2026-06-27 | |||
| H1505S-2WR2 | MORNSUN/金升阳 | DIP | 18+ | 47 | 2026-06-27 | |||
| IB0512XT-W75R3 | MORNSUN/金升阳 | DIP | 20+ | 100 | 2026-06-27 | |||
| TD521D485H-A | MORNSUN/金升阳 | DIP | 24+ | 26 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| STM32F410CBT6 | ST/意法 | LQFP48 | 22+ | 2358 | 2026-06-27 | |||
| STM32L031C4T6 | ST/意法 | LQFP48 | 20+ | 221 | 2026-06-27 | |||
| STM32L431KCU6 | ST/意法 | UFQFPN32 | 21+ | 3921 | 2026-06-27 | |||
| STM32L431CCT6 | ST/意法 | LQFP48 | 25+ | 2220 | 2026-06-27 | |||
| STM32F412CGU6 | ST/意法 | UQFN48 | 21+ | 1510 | 2026-06-27 | |||
| STM32L412RBT6 | ST/意法 | LQFP64 | 21+ | 722 | 2026-06-27 | |||
| STM32L011K4U6 | ST/意法 | UFQFN-32 | 21+ | 737 | 2026-06-27 | |||
| STM32L476RGT3 | ST/意法 | LQFP-64 | 21+ | 43 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| 74AUP1G00GW-Q100H | NEXPERIA/安世 | SOT-353-5 | 21+ | 4593 | 2026-06-27 | |||
| PCA9306DCUR | TI/德州仪器 | VSSOP8 | 21+ | 2233 | 2026-06-27 | |||
| TLC555IDR | TI/德州仪器 | TSSOP30 | 21+ | 10000 | 2026-06-27 | |||
| AM26C31IPWR | TI/德州仪器 | TSSOP16 | 2324+ | 2000 | 2026-06-27 | |||
| RS1G125XF5 | RUNIC/润石 | SOT23-5 | 23+ | 412 | 2026-06-27 | |||
| RS0102YH8 | RUNIC/润石 | SOT-23-8 | 23+ | 1937 | 2026-06-27 | |||
| RS0102YUTDS8 | RUNIC/润石 | DFN1.4x1.0-8L | 23+ | 1972 | 2026-06-27 | |||
| RS0108YTQC20 | RUNIC/润石 | QFN3 | 23+ | 1637 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| XC9572XL-10TQG100C | XILINX/赛灵思 | TQFP100 | 21+ | 553 | 2026-06-27 | |||
| QSB363GR | ONSEMI/安森美 | SMD2 | 21+ | 19990 | 2026-06-27 | |||
| ITS5215LCUMA1 | INFINEON/英飞凌 | HSOP12 | 21+ | 620 | 2026-06-27 | |||
| XC3S500E-4PQG208C | XILINX/赛灵思 | QEP | 15+ | 285 | 2026-06-27 | |||
| M25P80-VMW6G | MICRON/美光 | SOP-8 | 15+ | 3690 | 2026-06-27 | |||
| LED7708TR | ST/意法 | VFQFN-48 | 21+ | 2500 | 2026-06-27 | |||
| AD8338ACPZ | ADI/亚德诺 | LFCSP-16 | 23+ | 1637 | 2026-06-27 | |||
| PCA9548ADBR | TI/德州仪器 | TSSPO-24 | 23+ | 1736 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| ADP150AUJZ-3.3-R7 | ADI/亚德诺 | SOT23-5 | 22+ | 2493 | 2026-06-27 | |||
| TPS62130RGTR | TI/德州仪器 | VQFN16 | 21+ | 1255 | 2026-06-27 | |||
| VN5050JTR-E | ST/意法 | HSSOP12 | 22+ | 1518 | 2026-06-27 | |||
| LT1776IS8#TRPBF | ADI/亚德诺 | SO-8 | 22+ | 2500 | 2026-06-27 | |||
| LT3094EDD#PBF | ADI/亚德诺 | DFN-12 | 22+ | 282 | 2026-06-27 | |||
| ME6211C33M5G-N | MICRONE/微盟 | SOT23-5 | 23+ | 543 | 2026-06-27 | |||
| NCA9511-DMSR | NOVOSENSE/纳芯微 | MSOP8 | 23+ | 2187 | 2026-06-27 | |||
| LT1764AEQ#TRPBF | ADI/亚德诺 | TO263 | 23+ | 132 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| STM8AF6223PCAX | ST/意法 | TSSOP-20 | 22+ | 2500 | 2026-06-27 | |||
| AT88SC0808CA-SU | ATMEL/爱特梅尔 | SOP8 | 1024 | 1 | 2026-06-27 | |||
| LT7911D | LONTIUM/龙迅 | QFN64 | 23+ | 1444 | 2026-06-27 | |||
| SGM2037-ADJXUDX6G/TR | SGMICRO/圣邦微 | UTDFN | 23+ | 1766 | 2026-06-27 | |||
| TPS7A9101DSKR | TI/德州仪器 | SON10 | 23+ | 995 | 2026-06-27 | |||
| S25FL256LAGMFI001 | CYPRESS/赛普拉斯 | SOP16 | 23+ | 1000 | 2026-06-27 | |||
| MT25QL128ABA1ESE-0SIT | MICRON/美光 | SOP8 | 23+ | 233 | 2026-06-27 | |||
| S34ML01G200TFI000 | SPANSION/飞索半导体 | TSOP48 | 23+ | 795 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| GD25Q16CSIG | GD/兆易创新 | SOP8 | 23+ | 2111 | 2026-06-27 | |||
| GD25S512MDYIGR | GD/兆易创新 | WSON-8 | 21+ | 525 | 2026-06-27 | |||
| GD25LQ16CSIG | GD/兆易创新 | SOP8 | 23+ | 984 | 2026-06-27 | |||
| GD25Q256DYIGR | GD/兆易创新 | WSON8 | 23+ | 564 | 2026-06-27 | |||
| DS35Q2GA-IB | DOSILICON/东芯 | WSON8 | 23+ | 787 | 2026-06-27 | |||
| W25Q16JVSNIQ | WINBOND/华邦 | SOP8 | 25+ | 1666 | 2026-06-27 | |||
| GD25Q64CSIG | GD/兆易创新 | SOP-8 | 23+ | 380 | 2026-06-27 | |||
| GD25Q64CSIG | GD/兆易创新 | SOP8 | 23+ | 465 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| OPA2889IDGSR | TI/德州仪器 | MSOP-10 | 20+ | 357 | 2026-06-27 | |||
| OP27GSZ-REEL7 | ADI/亚德诺 | SOP8 | 21+ | 1000 | 2026-06-27 | |||
| INA190A5IDCKR | TI/德州仪器 | SC70-6 | 21+ | 2001 | 2026-06-27 | |||
| TLV9061IDBVR | TI/德州仪器 | SOT23-5 | 21+ | 2000 | 2026-06-27 | |||
| OPA2322AIDR | TI/德州仪器 | SOP8 | 23+ | 513 | 2026-06-27 | |||
| tda7293 | ST/意法 | ZIP-15 | 23+ | 974 | 2026-06-27 | |||
| LM358DT | ST/意法 | SOP8 | 23+ | 1354 | 2026-06-27 | |||
| TLC2272CDR | TI/德州仪器 | SOP8 | 23+ | 1460 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| LTC3633AIUFD#TRPBF | ADI/亚德诺 | QFN28 | 19+ | 90 | 2026-06-27 | |||
| CH340N | WCH/沁恒 | SOP-8 | 25+ | 500 | 2026-06-27 | |||
| MX25L12833FZ21-10G | MXIC/旺宏 | 8-WSON | 22+ | 300 | 2026-06-27 | |||
| SRD-24VDC-SL-C | SONGLE/松乐 | DIP | 25+ | 5000 | 2026-06-27 | |||
| SRD-12VDC-SL-C | SONGLE/松乐 | DIP | 24+ | 2000 | 2026-06-27 | |||
| SRD-09VDC-SL-C | SONGLE/松乐 | DIP | 24+ | 2000 | 2026-06-27 | |||
| SRD-05VDC-SL-C | SONGLE/松乐 | DIP | 24+ | 1000 | 2026-06-27 | |||
| SRD-03VDC-SL-C | SONGLE/松乐 | DIP | 24+ | 1000 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| ATSAMR30-XPRO | MICROCHIP/微芯 | DIP | 22+ | 14 | 2026-06-27 | |||
| YSPKS5D9E10 | RENESAS/瑞萨 | DIP | 22+ | 5 | 2026-06-27 | |||
| YSPEHMI1S20 | RENESAS/瑞萨 | DIP | 22+ | 1 | 2026-06-27 | |||
| OM40008UL | NXP/恩智浦 | DIP | 22+ | 4 | 2026-06-27 | |||
| KWIKSTIK-K40 | NXP/恩智浦 | DIP | 22+ | 91 | 2026-06-27 | |||
| ATSAMA5D27-SOM1-EK1 | MICROCHIP/微芯 | DIP | 22+ | 18 | 2026-06-27 | |||
| MSP-EXP430F5529LP | TI/德州仪器 | DIP | 23+ | 15 | 2026-06-27 | |||
| MSP-EXP430FR2311 | TI/德州仪器 | DIP | 21+ | 5 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| SN74HC00DT | TI/德州仪器 | SOIC-14 | 22+ | 2000 | 2026-06-27 | |||
| SN74LVC2G17DCKRG4 | TI/德州仪器 | SC70-6 | 22+ | 2500 | 2026-06-27 | |||
| SN74HC595BRWNR | TI/德州仪器 | 16X1QFN | 21+ | 1500 | 2026-06-27 | |||
| PCA9306DC1Z | NXP/恩智浦 | VSSOP8 | 21+ | 30000 | 2026-06-27 | |||
| SN74HC244DWR | TI/德州仪器 | SOP20 | 21+ | 621 | 2026-06-27 | |||
| 74LVC541APW | NXP/恩智浦 | TSSOP20 | 19+ | 338 | 2026-06-27 | |||
| SN74AHC1G09DBVR | TI/德州仪器 | SOT-23-5 | 22+ | 1000 | 2026-06-27 | |||
| SN74AHC1G09DBVR | TI/德州仪器 | SOT-23-5 | 1000 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| SLWRB4259A | SILICON/芯科 | DIP | 22+ | 12 | 2026-06-27 | |||
| SLWRB4172B | SILICON/芯科 | DIP | 22+ | 5 | 2026-06-27 | |||
| SLWRB4181B | SILICON/芯科 | DIP | 22+ | 5 | 2026-06-27 | |||
| SLWRB4173A | SILICON/芯科 | DIP | 22+ | 5 | 2026-06-27 | |||
| SLWRB4170A | SILICON/芯科 | DIP | 22+ | 5 | 2026-06-27 | |||
| SLWRB4257A | SILICON/芯科 | DIP | 22+ | 3 | 2026-06-27 | |||
| SLWRB4308C | SILICON/芯科 | DIP | 22+ | 6 | 2026-06-27 | |||
| SLWRB4206A | SILICON/芯科 | DIP | 22+ | 87 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| YRCNR7F0C8021-BE | RENESAS/瑞萨 | DIP | 21+ | 13 | 2026-06-27 | |||
| LAUNCHXL-RM42 | TI/德州仪器 | DIP | 21+ | 8 | 2026-06-27 | |||
| ANT7-T-M24SR64 | 0 | DIP | 21+ | 22 | 2026-06-27 | |||
| STM32F429I-DISC1 | ST/意法 | DIP | 24+ | 23 | 2026-06-27 | |||
| STM32F4DIS-CAM | ST/意法 | DIP | 21+ | 12 | 2026-06-27 | |||
| STLINK-V3MODS | ST/意法 | DIP | 24+ | 43 | 2026-06-27 | |||
| STM8-SO8-DISCO | ST/意法 | DIP | 20+ | 40 | 2026-06-27 | |||
| MSP-EXP432E401Y | TI/德州仪器 | DIP | 19+ | 11 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| DK-V7-VC709-G | XILINX/赛灵思 | DIP | 22+ | 1 | 2026-06-27 | |||
| FRDM-K22F | NXP/恩智浦 | DIP | 22+ | 52 | 2026-06-27 | |||
| B2405XT-1WR3 | MORNSUN/金升阳 | DIP | 23+ | 22 | 2026-06-27 | |||
| PCAL6416AHF | NXP/恩智浦 | QFN24 | 21+ | 2521 | 2026-06-27 | |||
| T1100L | MORNSUN/金升阳 | DIP | 20+ | 44 | 2026-06-27 | |||
| F1224XT-1WR2 | MORNSUN/金升阳 | DIP | 20+ | 111 | 2026-06-27 | |||
| LH10-10D0512-02 | MORNSUN/金升阳 | 50 | 2026-06-27 | |||||
| T1100L | MORNSUN/金升阳 | 50 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| LT1776IS8#TRPBF | ADI/亚德诺 | SO-8 | 22+ | 2500 | 2026-06-27 | |||
| ADP151AUJZ-3.3 | ADI/亚德诺 | SOT23-5 | 21+ | 7257 | 2026-06-27 | |||
| MP24894GJ-Z | MPS/美国芯源 | SOT23-6 | 21+ | 3000 | 2026-06-27 | |||
| TLV73333PDBVR | TI/德州仪器 | SOT23-5 | 19+ | 6000 | 2026-06-27 | |||
| B2405S-2WR2 | MORNSUN/金升阳 | DIP | 22+ | 8 | 2026-06-27 | |||
| B2405S-1WR2 | MORNSUN/金升阳 | DIP | 20+ | 440 | 2026-06-27 | |||
| H2405S-2WR2 | MORNSUN/金升阳 | DIP | 20+ | 30 | 2026-06-27 | |||
| K7809-500R3 | MORNSUN/金升阳 | DIP | 21+ | 195 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| TLV9104IDR | TI/德州仪器 | SOP14 | 23+ | 2500 | 2026-06-27 | |||
| TLV9102IDR | TI/德州仪器 | SOP8 | 23+ | 2500 | 2026-06-27 | |||
| TLC27L2CDR | TI/德州仪器 | SOIC8 | 23+ | 2500 | 2026-06-27 | |||
| LMV797MMX/NOPB | TI/德州仪器 | VSSOP8 | 23+ | 3500 | 2026-06-27 | |||
| LMV324IDR | TI/德州仪器 | SOP14 | 23+ | 2500 | 2026-06-27 | |||
| LM2903YPT | ST/意法 | TSSOP-8 | 22+ | 4000 | 2026-06-27 | |||
| LM2903YPT | ST/意法 | TSSOP-8 | 4000 | 2026-06-27 | ||||
| OP27GSZ-REEL7 | ADI/亚德诺 | SOP8 | 1000 | 2026-06-27 |